LOW DK & DF

LOW DK & DF

Low Loss&High Heat Resistance Material

特点            

1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
2. 低Z轴膨胀系数，优异的通孔可靠性
3. 低吸水率

应用领域            
通讯设备、网络设备、高频测量设备等

 FEATURES     

1. Dk/Df(10GHz):3.5~4.0/0.0065~0.0075
2. Lower Z-axis CTE , offering superior PTH reliability
3. Lower moisture absorption

 APPLICATIONS     
Network equipment , High frequency measuring instruments etc.

GENERAL PROPERTIES    

Test ltem

Unit

Test Method

Treatment Condition

Property Data

SPEC

Typical Value

Thermal

Glass Transition
Temperature,Tg

℃

DMA

A

＞180

200

Thermal
Expansion,
Z-CTE

ppm/℃

IPC-TM-650
2.4.24

Before Tg

＜60

45

After Tg

＜260

210

50-260℃

＜3.0

2.6

Decomposition Temperature,Td

℃

IPC-TM-650
2.4.24.6
5%wt loss

A

＞370

383

Delamination
Time,T288

Min

IPC-TM-650
2.4.24

A

＞60

120

Delamination Time,T300

Min

IPC-TM-650
2.4.24

A

＞30

60

Humidity
Resistant

Cycle

/

85℃/85%RH,168hr
288℃/10sec,Dipping

＞3

＞10

Dlelectrlc

Dielectric
Constant,(DK)

/

IPC-TM-650
2.5.5.9

1GHz

3.85

/

SPDR,RC55%

10GHz

4.05

Dissipation
Factor(Df)

/

IPC-TM-650
2.5.5.9

1GHz

0.0035

/

SPDR,RC55%

10GHz

0.0068

Physlcal

Peel Strength,
RTF/1OZ

IBS/IN

IPC-TM-650 2.4.8

288℃/10s

＞4

5.8

Water Absorption

%

IPC-TM-650 2.6.2.1

\

＜0.35

0.09

Flammability

/

UL94

A

V0

V-0(Br)

Note:
the treatment of letters and numerical meaning
    A - plate delivery stage
    D - constant temperature water bath E - high temperature baking number 1 / number 2:1 - time (hours) 2 - temperature ( ℃)    des - drying 10 minutes or more or drying condition cooling to room temperature.

PURCHASING INFORMATION    

Thickness

Copper foil

Standard Size

0.8mm  to  3.4mm

12μm  to    105μm

1041×1245mm（41″×49″）    940×1245mm（37″×49″）
1092×1245mm（43″×49″）    

※ Other sheet size and thickness could be available upon request.